CLEARFIL SE BOND 2 can now be classified as a truly universal adhesive. A new integrated photo-initiator chemistry provides more free radicals when curing, which relates to higher monomer conversion rates and stronger bonds.
When combined with CLEARFIL DC Activator, a low film thickness is formed which is ideal for indirect restorations (3-5 microns).CLEARFIL SE BOND 2 is a self-etch, two-step, light-cure bonding agent which offers the same benefit of reduced post-operative sensitivity (just like its predecessor, CLEARFIL SE BOND).
The gold standard is now a truly universal adhesive, making it ideal for all direct/indirect applications. The best just got better!!
